True but I think the difference is smaller than one might expect from pure element size.
IIRC one reason we don't already have fully 3D chips is because of the heat dissipation. Reducing 2400 W to 24 W means the heat is much more tractable, which means it can be closer to volumetric than planar.
Consider a 1cm*1cm*1mm chip; with 1μ^3 elements, 1e11 per chip; with (10nm)^3 elements limited to one layer because of heat, 1e12.
Yes this is still a factor of x10, and chips are a few layers because while heat is a problem it's not a total blocker, but it's still much less than the 100^3 ratio a simple scale-up would result in.
Maybe, but then we need to make sure light does not seep into neighboring cells, will need metal shields for that, and then heat will dissipate ... maybe they could solve this in the future.
IIRC one reason we don't already have fully 3D chips is because of the heat dissipation. Reducing 2400 W to 24 W means the heat is much more tractable, which means it can be closer to volumetric than planar.
Consider a 1cm*1cm*1mm chip; with 1μ^3 elements, 1e11 per chip; with (10nm)^3 elements limited to one layer because of heat, 1e12.
Yes this is still a factor of x10, and chips are a few layers because while heat is a problem it's not a total blocker, but it's still much less than the 100^3 ratio a simple scale-up would result in.