What's the thermal story? Looks pretty terrible so far. The case has no holes. The board has no holes for the heatsink, so you'll have to glue it. Space for heatsink is small.
Is it made so that the board serves as a heatsink at the very least?
The Raspberry Pi 3 B+ was the exception more than the norm. Clocking the A-53 at 1.4GHz on 40nm really sucked down the juice. The processor used in the 4 is probably not running on the very edge of its maximum potential.
As for heatsinks, you've always "glued" them, I even have a few I have permanently epoxied on instead of the included adhesive.
I don't care about other cases. I care about what the vendor's case suggests. That is that this chip either runs quite cool (so creating a worst case scenario with a fully closed case doesn't matter), or that they don't care about the cooling for some other reason.
I somehow doubt a chip with a heatspreadder is meant to run cool, though. It looks like they're sacrificing performance here.
Is it made so that the board serves as a heatsink at the very least?